Desoldering Nozzle from WELLER: XDSL 5
The XDSL 5 (Item No. T0051326399) is a desoldering/suction nozzle from WELLER designed for removing solder using heat and vacuum. The product is part of the XDS Saugdüsen family (Tip Family XDSL) and comes as one unit per package.
Function and Construction
WELLER describes the XDSL 5 as a heated suction nozzle that melts solder, after which the liquid solder is sucked up through an integrated tube when vacuum is activated and transferred to a solder collection container (Zinnsammelbehälter). The design is a desoldering nozzle with dimensions specified below.
Typical Applications
- Removes solder from solder points using heat and vacuum.
The above application is based on the manufacturer's statement that the nozzle melts solder and sucks the liquid solder away through an integrated tube.
Documentation
See datasheet from the manufacturer
Specifications
- Product Name: XDSL 5
- Manufacturer: WELLER
- Item No / Manufacturer No.: T0051326399
- Inner Diameter: 1.8 mm
- Outer Diameter: 3.3 mm
- Nozzle Length: 10.5 mm
- Quantity per Package: 1 pc.
- Tip Family: XDSL
- Product Family: XDS Saugdüsen
- UPC: 037103275608
- Function: Heated suction nozzle; liquid solder is sucked up through integrated tube when vacuum is activated (according to manufacturer)
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