KYZEN E5631 – cleaning agent for stencils and misprinted PCBs
KYZEN E5631 is a concentrated cleaning agent for the efficient cleaning of stencils in professional electronics manufacturing. It removes raw solder paste and flux from stencils and can also be used for cleaning misprinted PCBs on the A-side.
E5631 is designed to work at low concentrations and can be used at room temperature. This makes the cleaning agent suitable for both spray-in-air and ultrasonic cleaning, where effective and controllable stencil cleaning with low consumption of cleaning agent is desired.
Effective removal of solder paste from stencils
During stencil printing, residues of solder paste can accumulate in apertures and on the surface of the stencil. KYZEN E5631 dissolves the flux component in the solder paste so that residues can be removed effectively and the stencil cleaned thoroughly.
The cleaning agent can be used for various types of solder paste, including water-soluble, resin-based, and No-Clean formulations. This makes E5631 relevant in electronics manufacturing with different soldering processes and product types.
For spray-in-air and ultrasonic cleaning
KYZEN E5631 can be used in several types of equipment and processes for stencil cleaning. The product is documented to be compatible with, among other things, stencil foils, epoxy-based adhesives, frames, and mesh, as well as materials normally used in stencil cleaning equipment.
Typical process data:
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Application: Cleaning of stencils and A-side misprints
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Process: Spray-in-air and ultrasonic
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Concentration: Below 25%
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Process temperature: Ambient temperature to 49 °C
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Rinsing: DI water recommended
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Drying: Warm air recommended
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Flash point: None up to boiling point
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Boiling point: 104 °C
The optimal process parameters depend on factors such as the solder paste, cleaning equipment, and the specific production process.
Low concentration and wide material compatibility
E5631 is developed for efficient cleaning at relatively low concentrations. At the same time, the broad material compatibility allows the cleaning agent to be used in existing stencil cleaning processes when equipment and process parameters are suitable.
KYZEN describes E5631 as a biodegradable, water-based solution that is RoHS compliant and meets current REACH requirements.
Advantages of KYZEN E5631
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Removes raw solder paste and flux from stencils
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Suitable for A-side misprinted PCBs
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Can be used for water-soluble, resin-based, and No-Clean solder pastes
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Suitable for spray-in-air and ultrasonic cleaning
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Efficient at low concentrations
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Can be used at room temperature
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Compatible with stencil foils, frames, mesh, and epoxy-based adhesives
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DI water can be used for subsequent rinsing
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Developed for professional electronics manufacturing
What is KYZEN E5631 used for?
KYZEN E5631 is primarily used for cleaning SMT stencils after stencil printing. The cleaning agent removes residues of raw solder paste and flux, which can otherwise accumulate in the stencil's apertures and affect the transfer of solder paste during subsequent printing. It can also be used for cleaning misprinted PCBs on the A-side.