Product Overview
This understencil wipe, KYZEN E5631J, is a ready-to-use cleaning solution from KYZEN for removing raw solder paste from stencils. The product is formulated as an alternative to isopropyl alcohol (IPA) and is designed for use in both online and offline stencil cleaning processes.Features
- Ready-to-use understencil wipe.
- Formulated as an alternative to isopropyl alcohol (IPA).
- Stated compatibility with common stencils, cleaning equipment, and printer manufacturers.
Typical Applications
KYZEN E5631J is used for removing raw solder paste from stencils in online and offline stencil cleaning processes. The primary function of the product is to dissolve and remove raw solder paste from stencil surfaces as part of a stencil cleaning procedure.
Process Parameters (Recommendations)
- Concentration: Ready-to-use.
- Temperature: Ambient up to 120°F (49°C).
- Rinse: DI water or solvent rinse.
- Drying: Warm air drying.
Note: The mentioned process parameters are recommendations based on KYZEN's test data. KYZEN provides product bulletins, safety data sheets (SDS), and additional technical information via their product page or upon request from KYZEN's technical team.
Specifications
- Product Name: KYZEN E5631J.
- Manufacturer: KYZEN.
- Manufacturer's Part Number: E11287.
- Application: STENCIL CLEANER (stated on the product page).
- Boiling point: 212°F / 100°C.
- VOC @ 100%: 131 g/L.
- Water Soluble: Complete (stated as completely soluble in water).
- pH (10 g/L): N/A (solvent-based).
- Flash Point: None to Boiling (stated on the product page).
Source: Product information published by KYZEN on the manufacturer's product page for E5631J.
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