KYZEN E5631 stencil cleaning agent
KYZEN E5631 is a water-based cleaning agent developed for stencil cleaning in professional electronics manufacturing. It effectively removes raw solder paste and flux residues from stencils as well as A-side misprinted PCBs.
E5631 works at low concentrations and can be used at room temperature. It is suitable for spray-in-air, understencil, and ultrasonic cleaning, and can thus be used in various stencil cleaning processes.
Effective removal of solder paste and flux residues
E5631 is designed to quickly remove various types of raw solder paste and flux from stencils. Thorough stencil cleaning helps keep apertures free of residue and supports a stable stencil printing process.
The cleaning agent is compatible with stencil foils, epoxy-based adhesives, frames, and meshes, as well as materials typically used in stencil cleaning equipment.
For spray-in-air, understencil, and ultrasonic cleaning
KYZEN E5631 can be used in several different cleaning processes and is therefore relevant for both separate stencil cleaning and understencil cleaning in connection with the printing process.
Typical process data:
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Application: Cleaning of stencils and A-side misprinted PCBs
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Cleaning processes: Spray-in-air, understencil, and ultrasonic
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Concentration: Below 25%
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Process temperature: Ambient to 49°C
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Rinsing: DI water is recommended
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Drying: Warm air
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Water solubility: Complete up to 15%
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Flash point: None up to boiling point
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Boiling point: 104°C
The optimal process parameters depend on the cleaning equipment, solder paste, and the specific production process.
Benefits of KYZEN E5631
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Effective cleaning of SMT stencils
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Removes raw solder paste and flux residues
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Suitable for A-side misprinted PCBs
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For spray-in-air, understencil, and ultrasonic cleaning
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Used at low concentrations
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Can be used at room temperature
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Broad compatibility with materials in stencils and cleaning equipment
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Water-based and biodegradable
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RoHS compliant and meets current REACH requirements
What is KYZEN E5631 used for?
KYZEN E5631 is used for cleaning SMT stencils where residues of raw solder paste and flux must be removed from the stencil surface and apertures. The cleaning agent can be used in spray-in-air and ultrasonic systems as well as for understencil cleaning. It is also suitable for cleaning A-side misprinted PCBs.