Cleaning fluid CYBERSOLV C8882 for stencil washing 25 liters

Product Overview

CYBERSOLV C8882 is a solvent-based stencil cleaning liquid from KYZEN (Manufacturer part number: E01308). The product is formulated for the removal of solder paste, uncured SMT adhesive, and flux residues from stencils, misprinted boards, stencil tools, and board squeegees. CYBERSOLV C8882 is described as fast-drying, having a mild solvent odor, and effectively dissolving flux components without leaving residues.

Technical Specifications

• Type: Solvent-based stencil cleaning liquid.
• Flash point: 142 °F (61 °C).
• Boiling point: 270 °F (132 °C).
• Water solubility: Partial.
• VOC at 100%: 875.6 g/L.
• pH (10 g/L): Not applicable (solvent-based).
• Fast-drying; mild odor; dissolves flux components.
• Compatible with nano-coated stencils and with wet components in automated understencil wipe systems.

Typical Applications

CYBERSOLV C8882 is used for the following verified cleaning and maintenance processes, as indicated by the manufacturer:

• Understencil wipe processes (automated understencil wipe systems).
• Hand-wiping of stencils and tools.
• Ultrasonic cleaning (hand-held ultrasonic cleaner).
• Spray systems designed for solvents.

Recommended Process Parameters

• Concentration: 100% (recommended by the manufacturer).
• Temperature: Ambient (room temperature).
• Rinse: Optional.
• Drying: Air dry as indicated by the manufacturer.

Note: The process parameters above are the manufacturer's recommendations based on laboratory tests; KYZEN recommends contacting their sales/technical team for optimizing process parameters for specific applications.

Specifications

• Product Name: CYBERSOLV C8882.
• Manufacturer: KYZEN.
• Manufacturer's Part Number: E01308.
• Application: Stencil cleaner (removal of solder paste, uncured SMT adhesive, and flux residues).
• Flash point: 142 °F / 61 °C.
• Boiling point: 270 °F / 132 °C.
• Water solubility: Partial.
• VOC @100%: 875.6 g/L.
• Typical Process Parameters: 100% concentration, ambient temperature, optional rinse, air drying.
• Compatibility: Nano-coated stencils; compatible with wet components in automated understencil wipe systems (according to the manufacturer).

Source: KYZEN product information (manufacturer's product page).

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