SMT Adhesive for Surface Mounting
Description
PD955 PY from HERAEUS is a thermosetting, single-component, solvent-free polymer adhesive developed for surface mounting SMT components on printed circuit boards and for application on bare substrates. The product has a rheology specifically adapted for printing applications using metal and pump-print stencils, and it is formulated to provide high green strength during component placement.
Function and Features
- Thermosetting, single-component, solvent-free polymer adhesive.
- Colour: Yellow.
- Very high green strength that prevents component movement during placement.
- Proven good adhesion to both standard and difficult-to-bond components.
- Specific rheology for printing (metal and pump-print stencil) and suitable for dot forming.
Typical Applications
- Printing
- Pin Transfer
Process and Handling Information (verified)
Standard curing conditions are 125 °C for 3 minutes. When the curing profile is respected, PD955 PY can withstand reflow profiles according to IPC/JEDEC J-STD-020 with the examples provided by the manufacturer (1 min/180 °C; 1.5 min/150 °C; 3 min/125 °C; 8 min/100 °C). Maximum processing time at 20–30 °C is stated as 2 days. Cleaning before curing can be performed with Zestron HC and other Zestron and Vigon cleaners; alcohol should not be used as it will induce curing. After curing, defective components can be replaced by heating (hot air) above 100 °C and removal by torsional movement, followed by focused heating of residual adhesive before mechanical removal. Storage and conditioning instructions: store in original sealed containers, avoid high humidity and direct sunlight. Recommended cold storage is 2–10 °C; before opening, the product should stand for at least 2 hours at room temperature to avoid condensation. Cartridges should be stored with the nozzle pointing downwards.
Specifications
- Product name: PD955 PY
- Manufacturer: HERAEUS
- Manufacturer number: 89950488
- Type: Thermosetting, single-component, solvent-free polymer adhesive
- Application: Surface mounting of SMT components on PCBs and bare substrates
- Colour: Yellow
- Standard curing conditions: 125 °C / 3 minutes
- Reflow profiles per IPC/JEDEC J-STD-020 (examples): 1 min/180 °C; 1.5 min/150 °C; 3 min/125 °C; 8 min/100 °C
- Application types: Printing, Pin Transfer
- Processing time at 20–30 °C: Max. 2 days
- Cleaning agents before curing: Zestron HC and other Zestron and Vigon products (avoid alcohol)
- Storage: Sealed containers, recommended 2–10 °C; allow to warm up for 2 hours before opening
Current delivery time is up to 4 months. For larger projects or needs of 15–20 units or more, we can in some cases offer faster delivery – please contact us for more information.
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Contact HIN for further information about the product.