BALVER JEAN-151 SN100C-T3
BALVER JEAN-151 SN100C-T3 is a solder paste for professional electronics production, where reflow or vapour phase soldering is used. It is ROL0-classified, halogen-free, and belongs to the no-clean category, designed for processes where subsequent cleaning of solder residues is not required.
The paste is compatible with the SN100C alloy, i.e., Sn99.3Cu0.7NiGe, and is supplied in T3 powder size with a particle size of 25–45 µm. These are the factors that matter when choosing a paste for a specific stencil process and production flow.
The data sheet specifies a solidus/liquidus point of 227 °C and a recommended peak reflow temperature of 238–260 °C. This provides a clear starting point for process setup, especially when working with stable, repeatable soldering in series production.
The flux content is 11.2 % by weight, and residues after soldering are colourless. The product is supplied in a 500 g PP jar, and the stated minimum shelf life is 12 months when stored between 4 and 10 °C.
Typical applications
The paste is specified for standard electronics, industrial electronics, and hi-rel electronics, including automotive. It is also described as suitable for reflow and vapour phase processes.
Specifications
- Manufacturer: BALVER
- MPN: 2052950500
- Product name: JEAN-151 SN100C-T3
- EAN/GTIN: Not provided in the verified data
- Type: Solder paste, no-clean
- Classification: ROL0
- Halogen-free: Yes
- Compatible alloy: SN100C (Sn99.3Cu0.7NiGe)
- Particle size: 25–45 µm (T3)
- Solidus/liquidus: 227 °C
- Recommended peak reflow temperature: 238–260 °C
- Flux content: 11.2 % by weight
- Residues: Colourless
- Packaging: 500 g PP jar
- Minimum shelf life: 12 months at 4–10 °C
- See manufacturer data sheet
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