Microbond SMT645 F645 SnSb5-88M30 — no-clean solder paste for PCBs
Description
Microbond SMT645 F645 SnSb5-88M30 is a no-clean solder paste from Heraeus designed for PCB applications. The product is specified as paste F645 with Sn95/Sb5 alloy and 88% metal content. The paste properties are indicated as print-grade (viscosity M) and powder type 3 with a particle size of 25–45 µm.
Function and handling
The product is used as solder paste in printing processes and is specified for reflow in a controlled atmosphere. Reflow is recommended in N2 and/or vacuum with a time above liquidus of 60–120 seconds. The documentation specifies an average heating rate of 1–3 °C/s and a peak temperature that should be 15–40 °C above the melting point.
Practical handling instructions in the manufacturer's technical data sheet include:
- Storage at 2–10 °C.
- Before opening: allow the paste to reach room temperature (at least 4 hours, depending on packaging size).
- Stir the paste homogeneously for 1–2 minutes with a stainless steel spatula or chemically resistant plastic to achieve stable viscosity.
- Do not open the packaging while the product is cold to avoid condensation.
Cleaning
The product is classified as No clean / Solvent Clean. After reflow, flux residues may remain on the circuit board and do not need to be washed. If cleaning of wet paste or removal of residues is necessary, Zestron and Vigon are mentioned as suitable cleaning agents in the manufacturer's recommendations.
Typical applications
The specified application in the data sheet is printing. The product's viscosity (M) and powder type 3 are specified for printing processes.
Technical reference
See data sheet from the manufacturer
Specifications
- Product name: Microbond SMT645 F645 SnSb5-88M30
- Manufacturer: Heraeus
- Product ID / Paste: F645 (Product ID F645 SnSb5-88M30)
- Alloy: Sn95 / Sb5
- Metal content: 88%
- Viscosity: M (print-grade)
- Application: Printing
- Powder type: Type 3
- Particle size: 25–45 µm
- Melting point: 232–240 °C
- Flux activity: RELO (J-STD-004)
- ISO classification: ISO 9454-1 / DIN EN 29454-1 1.2.3.1
- Halogen: Halogen zero (halogen < 50 ppm, measured according to BS EN 14582)
- Classification: No clean / Solvent Clean
- Storage: 2–10 °C
- Reflow atmosphere: Reflow in N2 and/or vacuum
- Time above liquidus: 60–120 s
- Average heating rate: 1–3 °C/s
- Peak temperature: 15–40 °C above the melting point
- Compatible flux products: Flux SF 64 (stated as compliant)
Current delivery time is approx. 4 months. For larger projects or needs of 15–20 units or more, we may in some cases offer faster delivery – please contact us for more information.
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Contact HIN for further information about the product.