Product Overview
CYBERSOLV C8508 from KYZEN is an aqueous-based maintenance cleaner for reflow ovens and general equipment maintenance. CYBERSOLV C8508 is formulated to remove adherent residues that outgas during the reflow soldering process, including solder paste activator residues and functional additive buildup.
Function and Features
- Aqueous-based maintenance cleaner intended for use at 100% concentration at room temperature.
- Removes baked-on flux residues, including the latest lead-free flux formulations.
- Removes solder paste activators and functional additive buildup from equipment surfaces.
- Compatible with materials listed by the manufacturer: aluminum, copper, and brass.
- Recommended rinse method: clean, wet cloth; air dry.
- Recommended application methods (listed by the manufacturer): manual, spray, and immersion.
Typical Applications
CYBERSOLV C8508 is used for cleaning reflow ovens and for general equipment maintenance, as specified by the manufacturer. The product is designed to remove the specific types of residues that occur during the reflow soldering step, including solder paste activators and functional additive buildups.
Documentation
For complete product information and further technical guidance, please refer to the manufacturer's product page: KYZEN product page for CYBERSOLV C8508.
Specifications
- Product Name: CYBERSOLV C8508.
- Manufacturer: KYZEN.
- Manufacturer's Part Number: E05383.
- Type: Aqueous-based maintenance cleaner for reflow ovens and equipment maintenance.
- Application concentration: 100% at room temperature.
- pH (10 g/L): 10.7.
- Boiling point: 221°F / 105°C.
- VOC at 100%: 299 g/L.
- Rinse: Clean wet cloth; air dry.
- Typical process: Manual, spray, immersion.
- Compatible materials (stated by manufacturer): aluminum, copper, brass.
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