CYBERSOLV C8508 25 liters for cleaning flux on PCBs & machines

CYBERSOLV C8508 25 liters for cleaning flux on PCBs & machines

Kyzen

SKU:C8508-25

In stock

📄 KYZEN_SDS_C8508 25_DK View full details

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CYBERSOLV C8508 — water-based maintenance cleaner

CYBERSOLV C8508 from KYZEN is a water-based cleaner designed for cleaning reflow ovens and general equipment maintenance. The product is formulated to remove attached residues that outgas during reflow soldering of surface-mounted circuits, including residues from solder paste activators and functional additives.

Technical description

CYBERSOLV C8508 is stated by the manufacturer to be effective for removing baked-on flux residues, including lead-free formulations. The product is fully water-soluble and stated to be compatible with materials mentioned by KYZEN, including aluminum, copper, and brass. Application parameters from the manufacturer typically indicate use at full strength (100%) at room temperature.

Typical applications

  • Cleaning of reflow ovens (removal of attached outgassed residues from the reflow process).
  • General equipment maintenance for removing dried flux residues and functional additives on tools and equipment.

Method of application

  • Processes specified by KYZEN: manual, spray, or immersion.
  • Concentration: 100% (full strength) at room temperature.
  • Cleaning rinse: wipe subsequent with a clean, wet cloth.
  • Drying: air drying.

The information above is based on the manufacturer's technical product information provided on KYZEN's product page. Source: KYZEN product page (https://kyzen.com/cleaning-chemistries/cybersolv/cybersolv-c8508/).

Specifications

  • Product name: CYBERSOLV C8508.
  • Manufacturer: KYZEN.
  • Manufacturer's part number: E05382.
  • Type: water-based cleaner for reflow ovens and equipment maintenance.
  • Application: maintenance cleaning.
  • Processes: Manual, Spray, Immersion.
  • Concentration: 100% (full strength) at room temperature.
  • Rinse: clean, wet cloth; air drying.
  • Compatibility: aluminum, copper, brass (stated by manufacturer).
  • pH (10 g/L): 10.7.
  • Boiling point: 221°F / 105°C.
  • Flash point: None to Boiling.
  • Water solubility: Fully water-soluble.
  • VOC @ 100%: 299 g/L.
  • Removal: effective against baked-on flux residues, including lead-free formulations (stated by manufacturer).

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