CYBERSOLV C8508 — water-based maintenance cleaner
CYBERSOLV C8508 from KYZEN is a water-based cleaner designed for cleaning reflow ovens and general equipment maintenance. The product is formulated to remove attached residues that outgas during reflow soldering of surface-mounted circuits, including residues from solder paste activators and functional additives.Technical description
CYBERSOLV C8508 is stated by the manufacturer to be effective for removing baked-on flux residues, including lead-free formulations. The product is fully water-soluble and stated to be compatible with materials mentioned by KYZEN, including aluminum, copper, and brass. Application parameters from the manufacturer typically indicate use at full strength (100%) at room temperature.
Typical applications
- Cleaning of reflow ovens (removal of attached outgassed residues from the reflow process).
- General equipment maintenance for removing dried flux residues and functional additives on tools and equipment.
Method of application
- Processes specified by KYZEN: manual, spray, or immersion.
- Concentration: 100% (full strength) at room temperature.
- Cleaning rinse: wipe subsequent with a clean, wet cloth.
- Drying: air drying.
The information above is based on the manufacturer's technical product information provided on KYZEN's product page. Source: KYZEN product page (https://kyzen.com/cleaning-chemistries/cybersolv/cybersolv-c8508/).
Specifications
- Product name: CYBERSOLV C8508.
- Manufacturer: KYZEN.
- Manufacturer's part number: E05382.
- Type: water-based cleaner for reflow ovens and equipment maintenance.
- Application: maintenance cleaning.
- Processes: Manual, Spray, Immersion.
- Concentration: 100% (full strength) at room temperature.
- Rinse: clean, wet cloth; air drying.
- Compatibility: aluminum, copper, brass (stated by manufacturer).
- pH (10 g/L): 10.7.
- Boiling point: 221°F / 105°C.
- Flash point: None to Boiling.
- Water solubility: Fully water-soluble.
- VOC @ 100%: 299 g/L.
- Removal: effective against baked-on flux residues, including lead-free formulations (stated by manufacturer).
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