Product Overview
This solder preform from SENJU, referred to as Senju "Chip" preform (part number S-M705-1608), is designed to reinforce areas where the amount of solder material is insufficient. The product's core function is to add extra solder material to local areas to improve the filling of the solder joint without altering the surrounding solder flow.Functional Features
- Designed to reinforce areas with insufficient solder volume.
- Unique pressing method that flattens all four connection surfaces on the chip.
- Capable of automated assembly using a chip mounter.
- Can be used to reinforce solder joints on pin through-hole components when reflow processing is applied.
Typical Applications
- Used to reinforce local solder joints in areas with insufficient solder volume.
- Can be automatically assembled with other electronic components using a chip mounter.
- Used as reinforcement for connections to pin through-hole components during subsequent reflow treatment.
Specifications
- Manufacturer: SENJU (Senju Metal Industry Co., Ltd.)
- Product Name: Senju "Chip" preform
- Manufacturer's Part Number: S-M705-1608
- Product Category: Solder preform
- Primary Function: Reinforcement of areas with insufficient solder volume
- Manufacturing Feature: Pressing method that flattens all four connection surfaces
- Assembly: Capable of automated assembly with a chip mounter
- Process Compatibility: Can be used with reflow to reinforce pin through-hole connections
- Inquiries: Handled via the manufacturer's inquiry form on the product page
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