PDR Rework: IR-based Rework Systems

When advanced circuit boards and complex components need repair or replacement, it demands high precision, temperature control, and process stability. PDR Rework is among the leading manufacturers of IR-based rework systems for the electronics industry and is known for its patented Focused IR technology for safe and controlled rework of BGA, QFN, CSP, and other SMT components, among others.

At HIN A/S, we assist electronics production facilities, development departments, service centers, and repair environments with professional solutions for PCB rework, BGA rework, and advanced component replacement – from compact manual systems to semi-automatic solutions like the PDR IR-Q3.

Be contacted regarding PDR Rework

  • What is PCB rework?

    PCB rework covers the repair, replacement, or reprocessing of components on printed circuit boards (PCBs). This may include, for example:

    • Replacement of defective BGA components
    • Rework of QFN and CSP packages
    • Repair of SMT components
    • Modification or updating of electronics
    • Reballing and component repositioning
    • Prototypes and debugging in the development phase

    Modern electronics place increasing demands on precision during the rework process, as components become smaller, PCBs more complex, and tolerances narrower. Therefore, many professional electronics manufacturers choose IR-based rework systems over traditional hot-air solutions. 

  • Advantages of Focused IR Technology

    PDR was among the pioneers in Focused Infrared rework technology and is now used globally in fields such as electronics manufacturing, aerospace, automotive, medical technology, and the defense industry.

    The technology is developed to deliver precise, controlled, and gentle heating directly to the component without unnecessary heat exposure to surrounding areas.

     

  • Benefits of PDR rework systems:

    • Precise temperature control and thermal profiles
    • Focusable IR heating without airflow
    • Reduced risk of thermal stress on PCBs and components
    • Gentle rework of sensitive and densely packed boards
    • Suitable for lead-free processes and fine-pitch components
    • High repeatability and documentation
    • Minimal impact on surrounding components

    Unlike traditional hot-air systems, Focused IR prevents small components from shifting during the process due to airflow. This provides greater process control and more stable results – especially on complex and high-value boards.

High-precision BGA rework

  • Demanding rework

    Today, BGA (Ball Grid Array) components are used in a wide range of advanced electronic products where high demands on performance and compact design make traditional packages insufficient. At the same time, the hidden solder joints make BGA rework particularly challenging.

  • Combines Features

    PDR’s rework systems have been specifically developed for this type of task and combine:

    • Advanced IR heating
    • Closed-loop temperature feedback
    • Optical alignment
    • Controlled reflow profiles
    • Precise component placement

  • Secure replacement

    This enables safe and reproducible replacement of, among other things:

    • BGA
    • µBGA
    • QFN
    • CSP
    • LED components
    • Fine-pitch SMT components

PDR IR-Q3 – Semi-automatic rework for demanding tasks

The PDR IR-Q3 is among the newer semi-automatic solutions from PDR, combining advanced automation with operator control and high precision. The system is developed for companies with high demands for quality, documentation, and consistent processes.

  • The system offers, among other things:
  • Automatic component lift and placement
  • Precision alignment
  • Programmable profiles
  • Controlled IR heating from top and bottom
  • Documentable rework processes
  • High repeatability for series tasks

The PDR IR-Q3 is particularly relevant for advanced electronics production, service and repair environments, and companies working with high mix / low volume production and complex PCBs.

Professional advice on rework solutions

  • Rework Solutions for the Electronics Industry

    At HIN A/S, we help companies find the right solution for their specific rework tasks. The choice of rework system depends on factors such as:

    • PCB size
    • Component types
    • Production volume
    • Documentation requirements
    • Process requirements and quality assurance
    • Requirements for automation and operator control

    We advise on complete rework stations, process optimization, and integration into existing electronics production.

  • This is why companies choose PDR rework systems

    PDR is known for reliable solutions with a focus on precision, user-friendliness, and process control. The systems are used globally by companies working with high-value electronics, where errors and thermal stress can have significant consequences.

    Typical industries and applications:

    • Electronics production
    • Automotive electronics
    • Aerospace and defense
    • Medical equipment
    • R&D and prototype development
    • Service and repair centers

  • Learn more about PDR at HIN A/S

    At HIN A/S, we combine technical product knowledge with practical experience from electronics production. We are happy to assist with sparring on rework system selection, process optimisation, and demonstration of PDR solutions.

    Contact us to learn more about the possibilities within:

    • PCB rework
    • BGA rework
    • IR rework systems
    • SMT repair
    • Reballing and component replacement
    • Semi-automatic rework solutions

PDr Rework Facilities

  • IR-E1 Rework Station

    The IR-E1 is the entry-level model in PDR's rework series, designed for companies seeking precise infrared rework without advanced placement and vision systems. The system combines focused IR heating with a 3-zone PCB preheater and automatic temperature profiling via ThermoActive software.

    The IR-E1 is particularly suitable for small to medium-sized PCBs where a simple and user-friendly solution for component replacement is needed. Component handling is performed manually with vacuum tools, making this unit the simplest and most economical model in the series.

    The IR-E1 differs from other models by:

    • Lowest investment level in the series
    • Manual component removal
    • No optical split-beam alignment
    • Simple operation with automatic profiling
    Send request 

  • IR-E2 Rework System

    The IR-E2 builds upon the IR-E1 and adds precise optical component alignment and a mechanical pick-and-place function. The system is equipped with PDR's split-beam prism system, which allows simultaneous viewing of both the component and solder pads during placement.

    For companies with regular BGA tasks, the IR-E2 offers significantly higher placement precision and more controlled component handling than the IR-E1.

    This distinguishes the IR-E2 from the IR-E1 by:

    • Split-beam optical alignment
    • Mechanical pick-and-place function
    • Placement accuracy down to 10 µm
    • More advanced component handling

    Send request 

  • IR-E3 Rework System

    The IR-E3 is designed for companies with higher demands for process control and documentation. In addition to the functions of the IR-E2, the user gets closed-loop temperature control with non-contact temperature monitoring of both the component and the PCB.

    The system is also equipped with a process camera for monitoring the reflow process and active PCB cooling after the process. This makes the IR-E3 particularly attractive for demanding BGA, QFN, and CSP applications where process stability and traceability are crucial.

    The IR-E3 differs from the IR-E2 by:

    • Non-contact temperature measurement on both PCB and component
    • Closed-loop temperature control
    • Integrated process camera
    • Active PCB cooling
    • Extended process control
    Send request 

  • IR-E6 Rework System

    The IR-E6 is designed for large and heavy circuit boards that exceed the capacity of the E1, E2, and E3. The system uses a gantry-mounted heating head and a larger preheater that can handle circuit boards up to 620 mm in length.

    The system is therefore particularly suitable for telecom, industry, aerospace, defense, and other applications with large PCBs or backplanes. Functionally, the IR-E6 is based on the same advanced platform as the IR-E3, but with a significantly larger working area.

    The IR-E6 differs from the IR-E3 by:

    • PCB capacity up to 620 mm
    • Larger IR preheater
    • Gantry-mounted heating head
    • Optimized for large and heavy circuit boards
    Send request 

  • IR-Q3 Rework Facility

    The IR-Q3 is PDR's most advanced rework system and has been developed for companies with a high component throughput or many rework tasks. The system is based on the technology from the IR-E3 Pro Evolution, but adds semi-automatic component removal and placement.

    The automated handling reduces operator dependency and ensures high repeatability between processes. At the same time, the system offers the highest placement accuracy in the series with up to 5 µm precision.

    The IR-Q3 differs from the IR-E3 by:

    • Automatic component removal
    • Automatic component placement
    • Placement accuracy down to 5 µm
    • Higher repeatability
    • Optimised for high mix / high volume production
    Send request 

Brian Nielsen

Sales consultant

bn@hin.dk

+45 31415152