S3016 ultra: Unmatched 3D AOI for underside inspection

The S3016 ultra 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and with high precision thanks to innovative 3D camera technology on the underside of the printed circuit board. Conductor boards as well as inspection objects on workpiece carriers are inspected at high speed in 2D, 2.5D and 3D. As a result, the S3016 ultra stands for maximum defect detection and highest throughput.

Viscom S3016 Ultra

Soren Tranberg

Sales consultant
+45 20198020
st@hin.dk

Søren Tranberg has worked with sales of SMT solutions to the Nordic electronics industry for 25 years. Through his many years of work with SMT, including MES and NPI software solutions as well as AOI/SPI/X-ray, Søren has acquired extensive knowledge of SMD production in practice, and he is happy to share this knowledge with customers.