Advanced inline X-ray inspection system (AXI) developed for fully automatic 3D inspection of PCBs in SMT production.

The system is designed for high-speed inspection with a focus on precise detection of hidden solder joint defects such as voids, head-in-pillow, and insufficient solder filling – especially in complex components like BGA, QFN, and THT. With integrated CT technology and powerful image processing, the iX7059 ensures reproducible and documented results directly in the production line.

The solution supports high volume, traceability, and stable process control, and is suitable for demanding electronics production where quality and reliability are crucial.

Fully automatic inline X-ray inspection system (AXI) developed for inspecting complete electronic devices and assemblies.

The system combines advanced 3D X-ray technology with high throughput and is designed to identify hidden solder defects, voids, and connection problems in complex products.

The solution enables stable, reproducible, and documentable quality control directly on the production line and supports full traceability. The iX7059 Device Inspection is suitable for manufacturers who demand high standards for process control, reliability, and efficient inline quality assurance.