S3016 ultra: Unmatched 3D AOI for underside inspection
The S3016 ultra 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and with high precision thanks to innovative 3D camera technology on the underside of the printed circuit board. Conductor boards as well as inspection objects on workpiece carriers are inspected at high speed in 2D, 2.5D and 3D. As a result, the S3016 ultra stands for maximum defect detection and highest throughput.

Soren Tranberg