S3016 ultra: Unmatched 3D AOI for underside inspection

The S3016 ultra 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and with high precision thanks to innovative 3D camera technology on the underside of the printed circuit board. Conductor boards as well as inspection objects on workpiece carriers are inspected at high speed in 2D, 2.5D and 3D. As a result, the S3016 ultra stands for maximum defect detection and highest throughput.

Heller Mark 7 reflow oven

Heller is the world's largest manufacturer of ovens. They have just launched a new version of the Mark7 that is industry 4.0 compatible. You can read more about the new Mark7 by clicking the link below.

  • HELLER MK7

    The new MK7 platform revolutionizes the Reflow industry with several new and groundbreaking designs! The MK7 incorporates all customer requirements for lower Delta T, reduced nitrogen consumption and extended Power Management, in a new low height that makes it easy to see across the production area.

  • 1936/2043 MARK5

    The ultimate high-volume production solution with conveyor speeds of up to 1.4 m/min to suit the fastest pick and place systems.

  • 1826 MARK5

    This machine provides consistent performance for high volume requirements while minimizing preventative maintenance and saving floor space.

Soren Tranberg

Sales consultant
+45 20198020
st@hin.dk

Søren Tranberg has worked with sales of SMT solutions to the Nordic electronics industry for 25 years. Through his many years of work with SMT, including MES and NPI software solutions as well as AOI/SPI/X-ray, Søren has acquired extensive knowledge of SMD production in practice, and he is happy to share this knowledge with customers.